Baking Process :

The wafer sheets are baked in the baking irons of the Wafer baking machine. The principle is the physical loosening due to water vapor. In order to utilize the water vapor development adequately for loosening the wafer sheet, three requirements have to be met:

- Optimum amount of water in the dough
- Thin pouring of the dough
- Fast heat transmission onto the dough
The optimum amount of water (TA 250 - 300%) determines the wafer sheet weight and its sensory characteristics, such as chewing impression and break stability. The thin-viscous mixture spread accurately and widely by the portioning bar over the lower baking plate to ensure the baking plate to be filled out uniformly.
The baking process is characterized by the rapid heat transmission which is achieved exclusively by conductance in short time.Functioning of the Wafer baking machine

Two baking plates are assembled in each baking iron. The baking irons are opened the liquid dough is applied and the baking plates are closed again. During a baking period of about 2 - 3 minutes at a baking temperature between 150 and 180 C the wafer sheets are baked. After that the wafer sheet are removed and wafer dough is poured again on the baking iron.

Processes during baking in the baking goods . The rapid closing of the upper baking plate causes the dough to get warm rapidly so that the dough can spread easily and full out the whole baking plate assisted by the reaction of the raising agent with Co2 production.

Favorable effects on the even spreading of the dough can be also be achieved by adding protei¬nases and alkalinizing of the dough with the rapid development of water vapor and the beginning sticking of the starch the viscosity of dough increases, which in turn causes a relatively vapor-tight mixture structure to be produced with gas bubbles, the later pores.The intensive loosening is mainly effected by the water vapor production to a smaller extent by the gas production of the raising agent. It occurs during the initial baking stage thanks to the rapid fixing of the structure. A later loosening in the final baking stage does not occur. After the crumb structure has developed the baking process is continued until a moisture content of about 1% is reached According to the size of the baking iron the wafer sheets are baked in different sizes.

Processes in the baking goods affected by the temperature:
. Temperature of the processes in the baking goods
20 - 25 C temperature of the wafer mixture
40 - 50 C reaction of the rising agent beginning sticking of the From 70 C development of crumbs
From 100 C reduction of moisture to less than 1% of the wafer mixture
140 - 150 C caramel production.
150 C production of roast material charring.

These are the processes going off in the baking goods during the baking process. Due to the sort baking time, the time reaction, such as action of the enzymes and sticking of the starch, are of an essentially lower level than is the case for baking other bake ware. By the rapid heat action on the wafer dough the enzymes contained in the flour are inactivated. The sticking level of the starch is lower due to rapid dehydration. The starch develops mainly dextrins by thermal reduction and in this way it contributes to the crispness of the wafer sheet.